Description
Specification
| Usable Capacities | 256GB |
| NAND Components | 3D NAND |
| Interface | PCIe Gen 3x4 NVMe 1.3 |
| Form Factor | M.2 2280 |
| Package Dimensions (L×W×H) | 123 x 85 x 4.3 mm |
| Product Dimensions (L×W×H) | 22 x 80 x 2 mm |
| Weight | 6.6g |
| Max Sequential Read* | 256GB: Up to 1700MB/s |
| Max Sequential Write* | 256GB: up to 1100MB/s |
| TBW | 256GB: 150 |
| PCIe Link Power Management | APST, ASPM, L1.2 |
| Operating Temperature | 0°C to 70°C |
| Storage Temperature | -40°C to 85°C |
| Certifications | BSMI, CE, FCC, KCC, VCCI, REACH, RoHS |
| MTBF | 2 Million Hours |
| Error Correction Code | Less than 1 sector per ten quadrillion bits read |
| Product Health Monitoring | Self-Monitoring, Analysis and Reporting Technology (S.M.A.R.T) |
| Full End-to-End Data path protection | Supported |
| Performance Optimization | TRIM (requires OS support) |
